The efficiency of monocrystalline silicon cells is approaching its theoretical limit of 29.56%, compelling the industry to pioneer new technological pathways. According to the IEA, the global PV sector faces a critical 5-year window for technological iteration. Tandem perovskite technology, with its ultra-high theoretical efficiency, is positioned as the next disruptive frontier. Stability remains a key bottleneck for industrialization, where encapsulation plays a decisive role.

As the industry’s first initiator of perovskite encapsulation standards, Betterial has long dedicated itself to reliability research for perovskite and tandem perovskite modules. Its newly launched Betterial® Tandem Perovskite Film achieves five major technological breakthroughs, accelerating the industrialization of tandem perovskite technology.

Exceptional Crosslinking & Peel Strength Under Ultra-Low Lamination

Compared to conventional thermoplastic films, Betterial® Tandem Perovskite Film utilizes reactive formulation design to achieve 10–60% crosslinking at 110–120°C. After 3× IEC aging sequences, peel strength exceeds >60 N/cm, ensuring superior thermal cycling resistance and enhancing module reliability and stability.

Peroxide-Free Low-Temperature Crosslinking Technology

Co-developed with a global chemical leader, its unique peroxide-free formulation ensures high-purity processing with zero low-MW leachables, eliminating chemical corrosion risks to perovskite layers from residual peroxide decomposition. This preserves structural integrity and stability.

Superior Thermal & Weathering Resistance

Outperforming traditional thermoplastic films, it features:Exceptional resistance to high temperature/humidity,Ultra-low water vapor transmission rate (WVTR)
Test results confirm:Zero yellowing after 48h at 150°C,No bubbles/delamination post-PCT 48h aging.

Perovskite Halogen Ion Adsorption/Capture Technology

Innovative functional micro-nano materials with rich mesoporous channels efficiently trap and immobilize volatile halogen ions (F⁻, Br⁻, I⁻) and Pb²⁺ during operation/aging. This blocks ion migration paths, significantly reducing passivation failure and interfacial delamination.

Multi-Technology Compatibility

The technology offers broad process windows and material adaptability, supporting encapsulation for:Single-junction perovskite modules,Thin-film modules,Lightweight modules
Demonstrating robust platform advantages.

Betterial’s tandem perovskite encapsulation provides a material foundation for high-efficiency, long-lifetime, low-degradation products. The company remains committed to innovation, empowering the PV industry toward higher efficiency, lower cost, and sustainable growth.

Visit Betterial at Booth 2.2H-E110 to discuss collaboration opportunities.